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Dalian jafeng semiconductor device co., ltd - Back End Packaging / Assembly Suppliers
Company : Dalian jafeng semiconductor device co., ltd
Department : marketing manager
Address 1 : No. 97, Guangxian Road, High-tech Zone
Address 2 :
City : Dalian Liaoning
State :
Post/Zip Code : 116025
Country : China
Phone : 86 411 84755101
Fax : 86 411 84791210
Email : sheilawu2009@gmail.com
Industry Memberships:
Description :
We are one professional manufacture of die bonders used for Transistor, ICs and LED package with high speed & high accuracy & competitive price.
Our products mainly are:
Epoxy Die Bonder:
1) HS-DC01: used in IC packaging, DIP, SOP, PLCC, SSOP, TSOP, QFP, BGA etc;
2) HS-DC02: used in the LED packaging;
Soft Solder Die Bonder:
3) SS-DT01: used in TO-126, TO-220 packaging;
4) SS-DT02: used in TO-92; TO-3P etc;
"Customized Service": we have the excellent technical support team, and so we can supply the customer service that means we R&D and produce the products in the scope of our electrical and electronics according to customers' service.
Here, we hope we can establish long-term business relationship with you. I'm not sure if you have interested in them?
Feel free to contact me anytime, I'd like to be of your service. Welcome you visit our website: www.visionjafeng.com
Best Regards,
sheila
Dalian Jafeng Semiconductor Device Co., Ltd
tel:86-411-84755101
fax:86-411-84791210
web: www.visionjafeng.com
email: sheilawu2009@gmail.com
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