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Semiconductor Equipment Corp. - Backgrind / Slicing / Lapping / Polishing Equipment Suppliers


Company : Semiconductor Equipment Corp.

Address 1 : 5154 Goldman Ave.

Address 2 : P.O. Box 8079

City : Moorpark

State : CA

Post/Zip Code : 93021-1760

Country : United States


Phone : +1 805 529 2293

Fax :


Email :


Visit Semiconductor Equipment Corp. Website


Industry Memberships:
SEMI Member


Description :

SEC manufactures assembly equipment for the microelectronic industry. Products include: pick and place, flip chip bonders, wafer mounters, dicing tape, die bonders, and rework equipment. We specialize in manual and semiautomatic systems.


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