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Semiconductor Equipment Corp. - Backgrind / Slicing / Lapping / Polishing Equipment Suppliers
Company : Semiconductor Equipment Corp.
Address 1 : 5154 Goldman Ave.
Address 2 : P.O. Box 8079
City : Moorpark
State : CA
Post/Zip Code : 93021-1760
Country : United States
Phone : +1 805 529 2293
Fax :
Email : sales@semicorp.com
Industry Memberships:
Description :
SEC manufactures assembly equipment for the microelectronic industry. Products include: pick and place, flip chip bonders, wafer mounters, dicing tape, die bonders, and rework equipment. We specialize in manual and semiautomatic systems.
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