The NXQ4006 Mask Aligner combines innovative design with precision alignment and exposure features.

The versatility of the NXQ4006 has made it the choice of manufacturing facilities, R&D Centers and university programs around the world, for a wide range of technologies.

 

It supports both vacuum and contact printing and will process partial and whole substrates up to 150mm (6”) diameter. 

 

Features

 

Ø  Substrate sizes from pieces to 150mm (6”) diameter

Ø  Manual X-Y joystick and micrometer theta alignment stage

Ø  Easy manual tray-load for substrate loading / unloading

Ø  Vacuum / Pressure contact exposure modes

Ø  VideoView CCTV splitfield/ singlefield Video Scope with zoom

o   Objectives – 2x, 5x, or 10x

Ø  Simple topside mask loading

Ø  UltraSense constant intensity UV power supply

Ø  UV Collimation lens for improved printing resolution

Ø  Shock Isolation table included as standard

Ø  Easy operation- ideal for multi-user labs

Ø  Low maintenance

 

 

Options

Ø  Infrared (IR) backside alignment

Ø  Large Gap Alignment

Ø  NUV Hg (280-350nm) / DUV Hg-Xe (220-280nm) exposure optics

Ø  Manual micrometer for X-Y alignment

Ø  MagnaView (optical) splitfield/ singlefield microscope

o   CCTV option for MagnaView microscope

o   Objectives – 2x, 5x, 10x, or 20x

o   Eyepieces – 10x or 15x

Ø  Pulsed exposure timer sequencing

 

Performance

Print Modes

Ø  Soft, Pressure or Vacuum modes

            Print Resolution                                            = / >1.0 microns*

            (with vacuum contact-)

  Substrate size                    from pieces 1sq cm, up to 150mm

            Alignment Stage

Ø  Alignment Travel X-Y                         Manual Joystick

Ø  Alignment Travel Theta                      Manual Micrometer

Ø  Stage Scan                                         +/- 10 mm

Ø  X-Y Movement                                   +/- 3.8mm

Ø  Theta Rotation Range                         +/- 7 degrees

Ø  Z Axis Shiftage                                   = / < .5 microns

Ø  Mask/ Wafer separation                     0 – 180 microns

Ø  Mask Size                                           2.5x2.5” up to 7x7”

Ø  Topside Alignment overlay*               1.0 microns

Ø  Bottomside Alignment Overlay*         >2 microns     

* Operator/ process dependant

Electronics

Ø  Programming & Control                      PLC with LCD Display                                                   

      Intuitive operator Interface for menu driven operation

UV Lamphouse/ UV Exposure Optics

Ø  UV Lamphouse                                   200/350W,350/500W or 500/1KW

Ø  Exposure Optics                                 UV (350-450 nm) standard

Ø  UV Uniformity                                     +/- 4%, 6” diameter field

 

System Requirements

Ø  Voltage                                                110VAC,/60 Hz or 240VAC 50Hz

Ø  Compressed Air                                  5.4 bar (80 PSI)

Ø  Vacuum                                              -0.7 bar (21” Hg)

Ø  Nitrogen (or CDA)                               3 bar (40 PSI)

 

System / Module Data

Ø  W x D x H                                           ~.1220mm x 915mm x  1423mm

(48” x 36”x 56”)

Ø  Weight                                                 217Kg  ( 480 Lb)