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CEA-Leti - Dicing Equipment Suppliers
Company : CEA-Leti
Address 1 : 17 rue des Martyrs
Address 2 :
City : Grenoble cedex 9
State :
Post/Zip Code : 38054
Country : United States
Phone : +1 406-752-2107 x7509
Fax :
Email : psiblerud@emc3D.org
Industry Memberships:
Description :
The mission of the international consortium EMC3D is to rapidly develop a cost-effective and manufacturable TSV (thru-silicon-via) for 3D chip stacking and MEMS integration.
Technology support for the consortium goals is from associate members Fraunhofer IZM, SAIT (Samsung Advanced Institute of Technology), KAIST (Korea Advanced Institute of Science and Technology), TAMU (Texas A&M University), CEA LETI, and NXP. Material members include The Dow Company, Enthone, Brewer Science, and AZ Electronic Materials with wafer service support from WRS Materials. Equipment companies are Applied Materials, Datacon, EV Group and Semitool.
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