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SET - Smart Equipment Technology - Bonders - Die Suppliers

 

Company : SET - Smart Equipment Technology

Address 1 : 131 Impasse Barteudet

Address 2 :

City : Saint-Jeoire

State :

Post/Zip Code : 74490

Country : France - [view global branches]

 

Phone : +33 450 35 83 92

Fax : +33 450 35 88 01

 

Email : egreneche@set-sas.fr

 

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Description :

As a supplier of semiconductor equipment dedicated to high precision applications for over 30 years SET has developed over 30 different types of equipment.

First introduced in 1981, the Device Bonder line became the primary focus of the company in 1997. With an installed base of more than 300 Device Bonders worldwide, SET is globally renowned for the unsurpassed post bonding accuracy and the flexibility of its systems. As a supplier of semiconductor equipment dedicated to high precision applications for over 30 years SET has developed over 30 different types of equipment. First introduced in 1981, the Device Bonder line became the primary focus of the company in 1997.

From the submicron placement and production capability of the FC300 to the process flexibility of the FC150, SET offers a continuous process path from research to production and confirms its leadership position within the industry.

To overcome challenges of oxide reduction before or during bonding sequence, SET recently developed a patented Semi-Open Confinement Chamber usable in Chip-to-Chip as well as in Chip-to-Wafer applications.

Thanks to several decades of high accuracy placement expertise, SET brings to the market cutting-edge nanoimprint solutions with the NPS300 which offer proven sub-micron alignment capabilities also combined with superior flexibility.