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Giga Connections, Inc. - Die Removal / Rework Suppliers
Company : Giga Connections, Inc.
Address 1 : 4182 Center Park Dr
Address 2 :
City : Colorado Springs
State :
Post/Zip Code : 80916-4505
Country : United States
Phone : 719-237-0990
Fax : 719-638-6399
Email : cbeebout@gmail.com
Description :
Giga Connections, Inc. provides a wide variety of specialized engineering services for semiconductor applications. One of these services is the removal of die from plastic or ceramic packages. We have developed a number of proprietary processes by which we can successfully remove any die from any package without damaging the die so that it can be used in a flip chip application or reassembled into a different package.
We have found that once this capability is known to be available, there are many cases where it is the "best available option". For example:
- There are occasions where a customer wants to build a few hundred engineering samples in a specific package, a flip-chip assembly or a multi-chip module (MCM) but they cannot purchase die in quantities smaller than 10,000 units. Small quantities of packaged units in a different package, however, are readily available.
- There are also occasions where a bond wire was missed or misbonded due to an incorrect wire bond diagram which was only discovered after a limited quantity of custom die had been encapsulated in a plastic package.
- There are other occasions where a die is urgently required in a different package than the package in which they are readily available.
- This option is often greatly preferable to waiting 12 weeks for another lot of silicon from a fab or foundry, especially when only a thousand or less die are required and are readily available in another package configuration.
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Giga Connections, Inc. is a licensed manufacture that also works closely with circuit board houses to apply Conductive Diamond Plate (CDP) to FR4, Flex and Kapton substrates for 3rd party designs. The Conductive Diamond Plating forms an electrical interconnect that demonstrates an ~1% impedance discontinuity, similar to a soldered junction, and consistently produces almost no inductance or capacitance, thereby achieving a connection bandwidth beyond 40 GHz.
Giga Connections, Inc. is open to other applications for its (CDP) process. (CDP) is a direct replacement for the Delphi Connection Systems “Gold Dot” interconnect, but with smaller pitch and higher bandwidth specifications. |
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