The premier international packaging, components, and microelectronics systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer our attendees an outstanding array of packaging technology information.

This year’s conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors. The 62nd ECTC will be held at the Sheraton San Diego Hotel and Marina, San Diego, California, USA from May 29 - June 1, 2012.

The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are Used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards. Committee Information