Hesse & Knipps Semiconductor Equipment GmbH manufactures high speed fine pitch wedge  bonders, heavy wire bonders and complementary equipment for semiconductor  backend assembly.

Fully automatic wedge bonders handle both thin wire bonding  and heavy wire bonding applications with aluminum, gold and copper round wire  from 12.5 micron (.0005) to 500 microns (.020) in diameter, plus ribbon wire  from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). 

Integrated pull and shear test; advanced setup; PiQC Process-integrated Quality  Control system for real-time production control.