Semiconductor buyers guide, directory and reference site.

CATEGORIES

Submit Event

Submit a semiconductor conference or event

Submit a semiconductor conference or event for inclusion in our calendar

Partner Program

Become a partner and obtain extra visibility in our semiconductor conference calendar

Become a partner and obtain extra visibility in our calendar

Home > Semiconductor Conferences and Events > ICEPT-HDP 2009
ICEPT-HDP 2009

ICEPT-HDP 2009

ICEPT-HDP 2009

City : Beijing

Country : China

Start Date : Monday, August 10, 2009

End Date : Thursday, August 13, 2009

Web : http://www.icept.org/16.html

Registration : http://www.icept.org/23.html

Call For Papers : http://www.icept.org/18.html

Contact Email : jamescai@tsinghua.edu.cn

 

Description :

On behalf of the China Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS), it is my great pleasure to invite you to submit abstracts and attend 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009), to be held in Beijing, China from August 10 to 13, 2009.

Hosted by CIE-CEPS, the International Conference on Electronic Packaging Technology (ICEPT) will celebrate her 10th anniversary this year.


Downloads:

iCalendar file What is this?

Download ICEPT-HDP 2009 iCalendar file

Opto System

 

SITE SPONSORS
Logitech Ltd Angstrom Sciences Questar Products - Automatic Wire Bonders Oxford Instruments