The 23rd IEEE International Conference on Micro Electro Mechanical Systems - MEMS 2010 will be held from January 24 - 28, 2010, in the Hong Kong Convention and Exhibition Center. We invite the participation of and contribution from MEMS researchers and engineers from universities, research institutions, and industries.

Reflecting the rapid growth of the MEMS field and the commitment and success of its research community, the MEMS conference series has evolved into the premier annual event reporting research results on every aspect of micro-systems technology. In recent years, it has attracted more than 800 participants and over 200 select papers were presented in oral and poster sessions.

The major areas of activity in the development of MEMS solicited and expected at this conference include but are not limited to:
* Fabrication processes and integration techniques
* Design, simulation and analysis tools with experimental verification
* Silicon and non-silicon materials
* Assembly and packaging approaches
* Metrology and operational evaluation techniques
* System architecture

The major areas of activity in the application of MEMS solicited and expected at this conference include but are not limited to:
* Mechanical, thermal, and magnetic sensors and actuators and systems
* Opto-mechanical microdevices and microsystems
* Fluidic microcomponents and microsystems
* Microdevices and systems for data storage
* Microdevices and systems for biomedical engineering
* Micro bio/chemical analysis systems
* Microdevices and systems for wireless communication
* Microdevices for power supply and energy harvesting
* Nano-electro-mechanical devices and systems
* Scientific microinstruments