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Amkor Technology - Micro Electro Mechanical Systems (MEMS) Suppliers

 

Company : Amkor Technology

Address 1 : 1900 S. Price Rd.

Address 2 :

City : Chandler

State : AZ

Post/Zip Code : 85248-1604

Country : United States - [view global branches]

Phone : +1 480 8215000

Fax :

 

Email : marketing@amkor.com

 

 

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Description :

Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services.  Founded in 1968, Amkor has become a strategic manufacturing partner for hundreds of the world's leading semiconductor companies and electronics OEMs, providing a broad range of advanced package design, assembly and test solutions.

Amkor's operational base encompasses more than 5 million square feet of manufacturing facilities, product development centers, and sales & support offices in Asia, Europe and the United States.  Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test.  Our design center offers best-in-class thermal, electrical and mechanical modeling and characterization, design automation, and support of DFM (design for manufacturing) and customer DFC (design for cost).  Amkor’s test engineering services span the scope of test program development to full product characterization for the packaging of RF, mixed signal, logic and memory devices.

The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions.  Amkor ‘s packaging formats include wafer level, chip scale, ball grid array, leadframe and the enablement of next generation 3D packaging solutions.  Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®) technology, and wafer level fan-out (WLFO).  3D configurations such as Package-on-Package (PoP), stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.  Furthermore, Amkor continues to improve mature package technologies with the application of new materials and processes.  Amkor’s recently introduced pin-gate molded PBGA pushes wire bonding down to 28nm while providing superior quality, reliability, and performance at even higher yields and reduced cost.

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