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Pac Tech USA Inc. - Micro Electro Mechanical Systems (MEMS) Suppliers
Company : Pac Tech USA Inc.
Address 1 : 328 Martin Ave.
Address 2 :
City : Santa Clara
State : CA
Post/Zip Code : 95050-3112
Country : United States
Phone : +1 408 588 1925
Fax :
Email : ron@pactech-usa.com
Industry Memberships:
Description :
Pac Tech designs and builds the worlds leading wafer bumping equipment for flip-chip, chip-scale packaging, and MEMS devices based on electroless metallization. The Pac Tech facility in Santa Clara, California offers contract wafer bumping and solders ball placement, product demonstrations, training, and sales support.
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