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3D Integrated Circuits
[3]
Audio
[4]
Back End Packaging / Assembly
[33]
Delay Locked Loops (DLLs)
[1]
Discrete Passive Components
[8]
Fabless Houses
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[40]
Integrated Circuits
[56]
Light Emitting Diodes (LED) & Signs
[11]
Liquid Crystal Display (LCD)
[47]
Micro Electro Mechanical Systems (MEMS)
[56]
Networking
[41]
OptoElectronics
[18]
Phase Locked Loops (PLLs)
[1]
Programmable Logic Devices (PLD)
[6]
Robotics / Motor Control
[6]
Semiconductors
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Networking
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Aeroflex Colorado Springs
Atheros Communications, Inc.
Bay Microsystems, Inc.
Bourns Inc. (BINC)
Broadcom Corporation
C2 Microsystems, Inc.
Cavium Networks
ChipStart
Cortina Systems
Design of Systems On Silicon (DS2)
DSP Group, Inc.
Emulation & Verification Engineering (EVE SA)
Entropic Communications Inc.
Exar Corporation
HiSilicon Technologies Co., Ltd.
IBM
Ikanos Communications, Inc.
Inphi Corporation
Integrated Silicon Solution, Inc. (ISSI)
Lantiq Beteiligungs GmbH & Co. KG
Lantiq Taiwan Co., Ltd.
LSI Corporation
NextIO, Inc.
Posedge Inc.
Quantenna Communications, Inc.
Quintic Corporation
Telecom Technology Center
Tilera Corporation
Tokyo Electron Europe Ltd
TranSwitch Corporation
VIA Technologies, Inc.
XMOS Semiconductor Ltd.
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