Plating is a method used for depositing a coating of metal on a surface through the use of passing a current through a conductive medium or electrolyte. It is used in techniques such as leadfinish, where a coat must be placed over the leads of an integrated circuit and exists as two types: pure metal plating and alloy plating.

Tin plating specifically is good for the electrochemical plating system. It contains four components. First is the cathode, or the surface that is to be coated. The second part is the anode, which is the source of the coating metal. Third is the electrolyte, which is responsible for passing the current through itself, and is an aqueous medium that allows the anode to transfer to the cathode. The fourth and final component is the power source, responsible for supplying the current that is necessary for plating.

The cathode involved in plating is also the electrode from where reduction occurs and electrons are consumed. The anode, by process of elimination, is where oxidation occurs, as well as being the source material for plating. These two must work in harmony to create a balanced reaction with an oxidized and reduced element.

There is a set energy necessary for plating to even begin to occur. This energy level is known as the electrochemical potential, or more commonly referred to as voltage. It is the sum of three voltages that are derived from the plating system. They are the ohmic potential, the reversible potential, and the overpotential. If these three voltages are greater than the total voltage or electrochemical potential, plating can occur.

Solder plating is also a form of alloy plating that will allow for electrochemical plating to occur. For something to be considered alloy plating, there must be an alloy involved, composted of two elements or more and at least one of these must be a metal. The properties of this alloy will then have better properties than the metal component, such as more corrosion resistance and a better solderability.