Semiconductor Back End Production Equipment

Back End Production Equipment	# of Listings
Bonders - Automatic Wire	36
Bonders - Ball	12
Bonders - Bumped Tape	4
Bonders - Die	50
Bonders - Tape Automated Bonding (TAB)	8
Chip-On-Board Systems	1
Cleaning / Washing	37
Cut and Down Set / Trim / Form	4
Decapsulation Systems	2
Deflashing / Degating Tools	4
Demarking Systems	2
Dicers - Ceramic	2
Dicers - General	26
Dicers - Saws	21
Dicers - Wafers	3
Die Coating Equipment	5
Die Feed / Sorter / Pick & Place	18
Die Removal / Rework	3
Die Separators	2
Dispensing Systems	12
Encapsulation / Potting	1
Feeding / Handling / Sorting Systems	9
Heat Sinks	1
Lead Finishing / Straightening Equipment	7
Lead Frame Taping	4
Lithography Systems	17
Marking / Imprinting / Labeling Equipment	19
Material Handling / Conveyor Systems	19
Memory Programmers	4
Molding / Encapsulation	13
Multichip Module Assembly	4
Package Lead Systems	7
Package Simulation / Characterization	5
Packaging	33
Passive Coatings	1
Printing Equipment	9
Sawing Equipment	1
Scribing Equipment	3
Solder Bumping Systems	14
Solder Guns / Irons	1
Solder Reflow / Soldering & Brazing	8
Surface Mount Devices (SMD)	4
Trim and Form Systems	9
UV Curing Equipment	4
Wafer Bonding Systems	13
Wafer Coating	19
Wafer Mounting / Taping Equipment	16