Semiconductor packaging is the final stage of semiconductor fabrication. Also known as integrated circuit packaging, the integrated circuit undergoes a number of operations before it becomes a finished semiconductor. The final step is always encapsulation, which is also another term for this technique. Once this series of processes is carried out, the semiconductor is ready to go to work.

As stated, there are numerous processes that must be carried out before semiconductor packaging is complete (3 main ones to be exact). The first of those is die attaching. The die is mounted and then fixed to the package. This step is rather simple in comparison to the more complex stages of this overall process. Sometimes, to save costs and energy, the die will be glued directly onto the substrate in lieu of  using a eutectic bond (though this is best for heat conduction).

The second step of semiconductor packaging, integrated circuit bonding, has a more extensive line of operations. This include wire bonding, flip chip, quilt packaging, tab bonding, film attaching and spacer attaching. The basic need for this step is in order to connect the integrated circuit to the rest of the semiconductor. Each process bonds the integrated circuit to a different area, such as wire bonding provides the interconnections to the printed circuit board, which then allows communication with the rest of the semiconductor. and flip chip connects the chip to external circuitry. This step of packaging is integral to the semiconductor, as it assures the overall functionality, much like a series of neurons in the human brain. 

The third and final step of semiconductor packaging is integrated circuit encapsulation, which is also sometimes used synonymously with the term packaging. Consisting of baking, plating, lasermarking and trim and form, this stage allows for the die to be encapsulated. Ceramic, epoxy, or plastic is preferred. This final step prevents damage and corrosion to the integrated circuit so that the semiconductor will continue to run smoothly with few defects. While the other two stages of semiconductor packaging focus on permitting the overall device to run and operate, this final process is a manner of protection for the overall package, though it is just as necessary as the other two steps.

Though this is the widely accepted method, there are also forms of semiconductor packaging that are not as common. This exception, proximity communication, attaches everything directly onto the printed circuit board: the die and die wires. The die parts are then covered with a blob of insulator. This form is used to capture input and output for optoelectronic devices.

Semiconductor packaging may be as complex as the assembly and fabrication of the rest of the semiconductor. The three performed operations, die attachment, integrated circuit bonding, and integrated circuit encapsulation, each contribute essential aspects to the overall functionality of the semiconductor. As with all other steps of semiconductor fabrication, if anything goes wrong in this stage, it can completely ruin the functionality of the semiconductor. For this reason, even with more inexpensive methods of fabrication, such as the use of glue in die attachment, everything must be done perfectly and precisely. Once this process is completed, the semiconductor is ready to be shipped out and get to work.