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Jipal Corporation - Packaging Suppliers
Company : Jipal Corporation
Address 1 : 18-8F, 295, Section 2, Kuang Fu Road
Address 2 :
City : Hsinchu
State :
Post/Zip Code : 300
Country : Taiwan
Phone : +886 3 572 5325
Fax :
Email : sales@jipal.com.tw
Industry Memberships:
Description :
JIPAL CORPORATION is a professional agent for packaging equipment & materials headquartered in Hsin-Chu ,Taiwan. The company was founded in 1990. JIPAL provides leading-edge service combine with customer’s needs. Our branch in Hsinchu,Taichung,Kaohsiung,Hong Kong, Shanghai,Tianjin,Leshan,Suzhou,Shenzhen and Singapore. Product:Allteq:Die Coater & Post W/B Inspection. Aurigin:Advanced Solder Ball Placement.Furukawa:UV Tape for Dicing, Grinding & BGA Singulation.Hitachi:LOC Mounter & Die Bonder.IKK: New Module Trim/Form System.Kinergy:QFN buffing Machine, ALF loader.MIT : Package Laser / Wafer Backside Marking, Lead Scanner, BGA/ QFN2D/3D Inspection, Chip Sorter. Okamoto:Wafer Back Grinder & Polisher. PAL:Ni/Au line and copper plating line for BGA Substrate.Teikoku:Wafer Mounter & Taper/Detaper. Towa :Auto Molding System, Solid BGA,BCC & QFN Singulation System JIGA:Cookson: Epoxy Molding Compound, Flux, Solder Ball, Solder Paste, Underfills, Getter.
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