| Automatic Test Equipment (ATE) |
8 |
| Ball Bond Sheer |
3 |
| Burn-In Boards / Performance Boards |
15 |
| Burn-In Systems |
30 |
| Burn-In Transfer Systems |
4 |
| Circuit Repair / Design Modification |
7 |
| Contamination Testing |
1 |
| Discrete Component Test Systems |
7 |
| Environmental Stress Systems |
11 |
| Failure Analysis Systems |
27 |
| Film Thickness |
1 |
| FPD Test / Measurement / Repair |
5 |
| Functional Testing |
29 |
| Handlers / Positioner Systems |
27 |
| LED Testers |
7 |
| Nondesctructive X-Ray |
2 |
| Nondestructive |
1 |
| Optical Test Systems |
8 |
| Package Testing |
3 |
| Parametric Test Systems |
11 |
| PIN |
1 |
| Printed Circuit Testing |
12 |
| Probe Cards / DUT Boards / Probing Boards |
42 |
| Probing Equipment |
63 |
| Reliability Testers |
7 |
| Structural Circuits / Test / Thermal Fixturing |
2 |
| Test Head Manipulators and Docking Stations |
13 |
| Wafer Probe Micropositioning Subsystems |
5 |
| Wafer Probes |
22 |
| Wire / Ribbon Bond Pull |
2 |