The capabilities of ProTec include development, analysis, production and refurbishment of process parts out of ceramics, metals, quartz, plastic and also with all coatings. We have developed a new cluster tool for dry etch wafer thinning as well as for stress release processes. Also we provide transfer e-chucks which are developed for secure handling of thin wafers down to a few microns.

ProTec offers solutions for handling and processing thin substrates based on its proprietary technology of Transferable Electrostatic Carriers