Wafer mounting is a part of die preparation that is done leading up to semiconductor fabrication. The wafer is attached to a ring using plastic tape and is performed directly before the wafer is cut and made into separate dice. The tape assures that the dice all stay in place during the process. The wafer is prepared for IC packaging in this process, and wafer mounting is the first step of the method, followed by dicing.

Though wafer saws can be difficult to use accurately, wafer mounting allows it to be done much easier. Once the wafer and wafer frame are attached to the dicing tape, the wafer is held securely so that it will not shift during processing. The tape contains a synthetic adhesive so that it can hold both of these components. Low impurity levels are a must, as with all semiconductor components and equipment, but it is also important that the tape be flexible while strong enough to hold the wafer and wafer frame in place. It is important that the wafer frame be resistant to warping and heat, but it can consist of either metal or plastic.

There are some things that must be avoided in wafer mounting, as it can be detrimental to the overall semiconductor should anything go wrong in the process. There are many defects that much be watched carefully, such as cracks, scratches and breaks in the wafer, while the tape must avoid bubbles and a non-uniform tension, as it can cause wrinkles and prevent the wafer from maintaining its thorough hold. These seemingly small things must be regulated to make sure the wafer is kept in prime condition.

While wafer mounting mostly depends on the tape, there must also be a laid out process of steps that will result in the mount being successful. First, the frame is loaded into the machine. The wafer follows the frame, being loaded into its own place. The next step is where the tape is applied, holding the wafer and the wafer frame firmly to avoid any movement once dicing occurs. The excess tape is trimmed and then the wafer and frame can be unloaded. After these simple steps have been applied, the wafer is ready for the saw and for dicing to begin.

Wafer mounting is the first half of die preparation and allows for the wafer to go onto the wafer saw. Through the use of PVC tape, the wafer is securely mounted so that it can be evenly diced. Die preparation allows for the wafer to go onto IC packaging, so making sure that the wafer is mounted properly for sawing is important for making sure it reaches the final step of semiconductor fabrication. The steps for mounting are very simple and seem easy, as it relies so much on pieces of tape, but it is also integral that the tape and wafer be monitored, as one defect can ruin the entire process and throw the wafer out of alignment, sawing it improperly. If it survives mounting and dicing, the wafer is only a few steps away from finally being fully fabricated.