Wet processing is a method used in different techniques that uses chemicals to do the job. There are several different technologies in the semiconductor industry, as well as other industries, that utilizes wet processes for etching, stripping, cleaning, and more. Wet technologies make it possible to rid wafers of unwanted materials that could not otherwise be done, and can also do these things faster than other processes capable of similar treatments.

Perhaps the most common application that comes to mind when one mentions wet processes is etching. Wet etching, also known as liquid etching, uses a series of chemicals to remove unwanted materials from the wafer in a pattern set up by a mask or photoresist. The wafer can either be submerged into the chemical bath or placing it into a wafer machine and employing gas. The etchant then begins to react with the composition of the wafer not protected by the mask, etching it off. Finally, the reacted byproducts are diffused from the surface of the wafer, leaving a finely etched wafer.

The only problem that results from wet etching is that, because it is an isotropic process, it creates a very large bias in the results, which is not useful for high end processes (those less than 3 microns). For that reason, wet process etching can only be used for larger etching processes. Each etchant also can only be applied to a certain type of element as well. This is due to the selectivity of chemical etchants, and as such the selectivity must be checked before beginning etching.

Cleaning is also an important wet process. It is done right before film deposition. A wet bench, a station for the process of etching and cleaning, can differ drastically, and so each type of procedure requires a different wet bench, all depending on the substrate used. Each wafer needs a different furnace or deposition as well, depending on the metals used to make it. Similar to etching, wet chemicals eat away at defects and unnecessary materials in order to make the wafer smooth and clean.

Wet processing helps to remove materials from the wafer. It can be used to etch, clean, and strip the wafer of particles that aren't needed. In etching, chemicals follow a certain pattern to create grooves while in cleaning, the chemicals immerse the wafer, stripping it of the unseen particles that cling to it. Due to its inability to etch below 3 microns, wet etching should not be used for creating fine patterns. Wet processing cannot be used for every element, but for what it can be used for, it does a very thorough job. Wet processing helps to smooth out flaws in wafers and rids them of excess residue.

Wet processing is a method used in different techniques that uses chemicals to do the job. There are several different technologies in the semiconductor industry, as well as other industries, that utilizes wet processes for etching, stripping, cleaning, and more. Wet technologies make it possible to rid wafers of unwanted materials that could not otherwise be done, and can also do these things faster than other processes capable of similar treatments.

Perhaps the most common application that comes to mind when one mentions wet processes is etching. Wet etching, also known as liquid etching, uses a series of chemicals to remove unwanted materials from the wafer in a pattern set up by a mask or photoresist. The wafer can either be submerged into the chemical bath or placing it into a wafer machine and employing gas. The etchant then begins to react with the composition of the wafer not protected by the mask, etching it off. Finally, the reacted byproducts are diffused from the surface of the wafer, leaving a finely etched wafer.

The only problem that results from wet etching is that, because it is an isotropic process, it creates a very large bias in the results, which is not useful for high end processes (those less than 3 microns). For that reason, wet process etching can only be used for larger etching processes. Each etchant also can only be applied to a certain type of element as well. This is due to the selectivity of chemical etchants, and as such the selectivity must be checked before beginning etching.

Cleaning is also an important wet process. It is done right before film deposition. A wet bench, a station for the process of etching and cleaning, can differ drastically, and so each type of procedure requires a different wet bench, all depending on the substrate used. Each wafer needs a different furnace or deposition as well, depending on the metals used to make it. Similar to etching, wet chemicals eat away at defects and unnecessary materials in order to make the wafer smooth and clean.

Wet processing helps to remove materials from the wafer. It can be used to etch, clean, and strip the wafer of particles that aren't needed. In etching, chemicals follow a certain pattern to create grooves while in cleaning, the chemicals immerse the wafer, stripping it of the unseen particles that cling to it. Due to its inability to etch below 3 microns, wet etching should not be used for creating fine patterns. Wet processing cannot be used for every element, but for what it can be used for, it does a very thorough job. Wet processing helps to smooth out flaws in wafers and rids them of excess residue.